XY + 2x Rotary Motion + 2X Z motions- Standard configuration has X,Y, stage to move the platen between polishing and imaging positions. In addition XY stage helps to oscillate wafer during polishing. Using Platen with XY drive allows an unique multi axis drive combination allows to create any custom motion to simulate testing conditions close to real life scenario.
Torque - High resolution inline torque sensors allows for end pointing, and characterizing surfaces in real time Acoustic - Sound signal signal that allows to qualitatively end point or help to detect debris, defects during polishing process.
Temperature - Inline temperature monitoring of pad and area close to wafer polishing surface helps to study the removal mechanisms.
Programmable load, Speed
To optimize the process CP-5000 allows to control and change down force, speed, flow rates using recipe based software.
Ease of use -The tribometer comes with FAST EXCHANGE carriers that allows to mount wafer and pads with ease. The software comes with predefined test standard recipes or new custom recipes can be created with ease.